Intel Agilex Micro Embedded SOM (eSOM5u-Ex)
Overview
This micro embedded System on Module (eSOM) features the Intel Agilex™ 5 E-Series FPGA in an ultra-compact 60 mm × 60 mm (2.36” × 2.36”) micro form factor, delivering high performance in space-constrained designs. Built for demanding embedded applications, it is ideal for high-speed signal processing, wireless nodes with high-performance RF transceivers (XVRs), and advanced networking solutions. Designed for reliability in harsh environments, the module supports industrial operating temperatures from –40°C to +85°C, making it well-suited for industrial, communications, and edge-compute deployments.
Features
- 60mm x 60mm form factor
- Two 200-pin high performance connector
with Serdes and IOs - Supports Agilex® 5 E-Series Group A and
Group B devices in B23A package- All devices in B23A package with 120 HVIO
(low speed, high voltage) and 96 HSIO pins - 12x XVRS for 028A/B, 043A/B, 052A/B and
065A/B devices (28Gbps/17Gbps) - 4x XVRS for 0013A/B, 008A/B devices
- All devices in B23A package with 120 HVIO
- 32-Bit 2GB LPDDR4 and 8GB eMMC
- Industrial temp design, -40C to 85C
- Paired with COTS and custom carriers (Hitek or customer developed)
for a quick time to market solutions
Target Markets
- 5G/ORAN and Satcom wireless systems
- Embedded high performance edge AI/ML systems
- Edge AI/ML image and signal processing
- 100G/50G/40G/25G/10G networking platforms
BSP and design support
- Complete Linux BSP support package
- Comprehensive APIs for board management
- Quartus reference projects
- Carrier boards design guide for custom carrier designs
Wireless/O-RAN and Networking Carrier
- 100mm x 112.5mm carrier with networking and FMC+ interface
- 5mm stacked height
- One QSFP28 connector; up to 100G Ethernet
- Designed to provide End-to-End 5G, wireless, satellite-bub and networking development platform for latest ADI and TI RF devkits
- Integrated Skyworks Si5518 Network Synchronizer for PTP/1588 and JESD204C/JESD204B clocking